COMPUTATIONAL FLUID DYNAMICS AMD EPYC™7003 Series Processors with AMD 3D V-Cache deliver outstanding scale-out performance running Ansys® Fluent® on Microsoft® Azure® HBv3 virtual machines. This ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...

Synopsys SNPS recently announced that it has designed a radio frequency (“RF”) design reference flow and design solutions kit (DSK) on Samsung Foundry's 8nm RF low-power FinFET process in ...

PITTSBURGH, April 24, 2019 /PRNewswire/ -- TSMC certified ANSYS (NASDAQ: ANSS) solutions for its innovative System-on-Integrated-Chips (TSMC-SoIC™) advanced 3D chip stacking technology. SoIC is an ...

In a move to address the growing complexity of semiconductor design, Ansys (NASDAQ:ANSS) has entered into a strategic alliance with Taiwan Semiconductor Manufacturing Company (NYSE:TSMC) and Microsoft ...

New Ansys and Synopsys reference flow for RFIC design developed for Samsung Foundry 14LPU process Collaboration delivers predictive accuracy of Ansys' golden signoff electromagnetic (EM) analysis with ...

Ansys RedHawk-SC™ and Ansys Totem™ power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology Ansys and ...

SANTA ROSA, Calif. April 24, 2024-- Keysight Technologies, Inc. (NYSE: KEYS), Synopsys, Inc. (Nasdaq: SNPS), and Ansys (Nasdaq: ANSS) introduce a new integrated radio frequency (RF) design migration ...

(NASDAQ: ) has collaborated with TSMC to certify that Ansys RedHawk-SC™ and Ansys® Redhawk-SC Electrothermal™ are compliant with TSMC's 3Dblox™ standard for the exchange of design data between ...

PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These ...