Apple is expected to use TSMC's new 2nm process and SoIC-X (System on Integrated Chip) advanced packaging technology in the second half of 2025, according to new reports. AMD was the first to adopt ...

In a new report from Ctee, Apple has the first production capacity out of TSMC in 2025 for its new 2nm process node, with plans to use next-generation 3D advanced packaging platform SoIC (or System on ...

Apple and TSMC revealed the A20 Pro chip built on 2nm process technology, doubling AI compute power and boosting sustained performance by 40% for ...

Apple’s next-generation A20 chip, leveraging TSMC’s second-gen 2nm process (N2), will be smaller, more power-efficient, and positioned closer to its onboard memory, boosting performance and reducing ...