PHILADELPHIA--(BUSINESS WIRE)--Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today introduced its new IKONIC™ polishing pad platform, bringing to market Dow’s most ...

PHILADELPHIA--(BUSINESS WIRE)-- Following the introduction of its IKONIC™ chemical mechanical planarization (CMP) polishing pad platform in late 2012, Dow Electronic Materials, a business unit of The ...

AURORA, Ill., Oct. 20, 2010 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq:CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and growing ...

Dow Electronic Materials, a unit of U.S. chemical kingpin The Dow Chemical Company ( DOW), has launched the first chemical mechanical planarization (CMP) polishing pads from its new IKONIC 2000 and ...

Aurora, IL, Jan. 24, 2011 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq:CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and a growing ...

Fujifilm is expanding its chemical-mechanical planarization (CMP) polishing agent production in Japan to meet the rising demand for AI chips in Asia. This expansion will increase production by 30% and ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Applied Materials, Inc. today announced its innovative Applied DuraPad ™ CMP polishing pad technology for 200mm chemical mechanical planarization (CMP) systems.

What Is Chemical Mechanical Polishing? Chemical mechanical polishing (CMP) or chemical mechanical planarization (CMP), is a technique used to smoothen and flatten surfaces at the nanoscale level. It ...

Polishing with the help of CMP slurries is an integral part of microcircuit manufacturing. The particle size distribution (PSD) measurement on the CMP slurries is required to ensure their health, ...

Dow Electronic Materials, today introduced the OPTIVISIONTM 4540 CMP Polishing Pad designed to deliver low defectivity and low cost of ownership (CoO) over pad lifetime. The new pad is formulated with ...