Jaro is using forging rather than casting to produce a pair of 51 x 51mm pin-fin heatsinks, one in copper and one in aluminium. “These designs leverage the superior metallurgy of cold forging and the ...

In recent years, increases in processing power mean advanced semiconductor devices now dissipate astounding levels of power. For many applications, cooling these devices has become a major challenge.

Available in footprints from 2.0 x 2.0 in. to 5.0 x 5.0 in. and heights from 0.7 to 2.0 in., a line of aluminum heat sinks uses a novel flared pin-fin design that minimizes friction to improve natural ...

TODAY'S CUTTING EDGE INTEGRATED CIRCUITS DISSIPATE SUBSTANTIALLY HEAVIER LOADS OF HEAT THAN EVER BEFORE. At the same time, the premium associated with miniaturized applications has never been greater, ...

Increasing the processing power of electronic equipment often means that more transistors have to be squeezed into tighter packages. And higher circuit densities increase the amount of heat that must ...

http://www.coolinnovations.comAs dissipated heat loads continue to rise, engineers seek increasingly efficient heat sinks. The efficiency of various heat sink ...

GlacialTech, the diversified LED technology provider, announces a new square heatsink using cold forging technology rated for 30W LEDs. The Igloo FS125S measures 125mm square and 25mm in depth, is ...