SiC and GaN device makers are using advanced junction structures and innovative packaging to offer more robust, cooler-running products. Advanced packaging technologies are also fueling the rise of ...

At the Applied Power Electronics Conference & Exposition (APEC 2025), celebrating its 40th year, over 300 exhibitors showcased their latest component advances for system power designers across a wide ...

A new study has revealed how tiny imperfections and vibrations inside a promising quantum material could be used to control ...

Texas Instruments is developing GaN power devices to enable more compact and efficient motor joints for humanoid robots.

Power electronics and semiconductor devices lie at the heart of modern energy conversion and control systems. Recent advances have focused on utilising wide‐bandgap materials such as silicon carbide ...

High-frequency magnetic characteristics are essential for improving the efficiency, miniaturization, and operating frequency ...

Researchers have demonstrated a significant performance increase in cooling technology for high-power electronic devices. They designed novel capillary geometries that push the boundaries of thermal ...

At the Applied Power Electronics Conference & Exposition (APEC 2023), over 270 component manufacturers showcased their latest innovations and technologies, aimed at system power designers. Power ...

“Power Boost” mode can be helpful in a pinch, but it’s only safe for certain appliances and devices. Here are best practices to follow.

Tokyo, Japan – The exponential miniaturization of electronic chips over time, described by Moore's law, has played a key role in our digital age. However, the operating power of small electronic ...