Seeking Alpha

Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor ...

The ASYMTEK Vantage® Dispensing system equipped with IntelliJet® Jetting system reduced underfill voids and decreased cycle time by almost 30%. Nordson’s industry-leading ASYMTEK Vantage® Series fluid ...
Digi Times

Powertech secures full FOPLP bookings ahead of US$1B expansion

Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's advanced ...
Reuters

China's Tsinghua Unigroup taking $600 million stake in Taiwan chip firm Powertech

TAIPEI/HONG KONG (Reuters) - Chinese state-backed technology conglomerate Tsinghua Unigroup Ltd is buying a 25 percent stake in Powertech Technology Inc for $600 million, becoming the largest ...
Digi Times

PTI overcomes awkward phase with FOPLP, expects major growth from 2026

Memory packaging and testing company Powertech Technology Inc. (PTI) has heavily invested in fan-out panel-level packaging (FOPLP) in recent years. Chairman DK Tsai stated that the new FOPLP products ...
Nasdaq

Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor ...

CARLSBAD, Calif.--(BUSINESS WIRE)-- Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) ...