Surface properties dictate a vast array of material characteristics that are crucial to performance, durability, and intended functionality across diverse industries. Properties such as friction, wear ...
Engineering material surface properties can influence some of the most important characteristics of materials, such as corrosion resistance, adhesion, color, conductivity, biocompatibility, and many ...
Surface technologies play an important role in accelerating the development of pharmaceutical products and in the optimisation of manufacturing processes so that ‘pipeline’ products reach the market ...
The aim of this article was to study the emergence of blemishes on the inner surface of aluminum MDI cans. Surface analysis of the blemishes proposed that the stain was a water-drying stain and it was ...
There are two photoelectron spectroscopy techniques which are widely used to analyze the surface of a nanomaterial. These are X-ray photoelectron spectroscopy (XPS) and ultraviolet photoelectron ...
Plasma resistant coatings are advanced protective layers engineered to withstand the aggressive conditions encountered in plasma processing, especially within semiconductor manufacturing. These ...
Interactions between iron, water, oxygen and ions quickly become complex. MTU scientists developed a more precise method to observe how iron minerals like rust form. One can easily see with the naked ...
X-ray photoelectron spectroscopy (XPS) is widely used for characterizing the uppermost 10 nm of a materials surface. Also called electron spectroscopy for chemical analysis (ESCA), the analytical ...
ISS involves the bombardment of a surface with a beam of ions, typically noble gas ions like helium or neon, under vacuum conditions. When these ions collide with the sample surface, they are either ...
Editor’s note: An open house is planned at the University of Delaware’s Surface Analysis Facility, located in Lammot du Pont Laboratory on UD’s Newark campus Friday, Sept. 23, from noon to 2 p.m. The ...
Following a brief historical background, the concepts and the present state of sputter-depth profiling for thin-film analysis are outlined. There are two main branches: either the removed matter (as ...
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