FREMONT, Calif.–Lam Research Corp. here today introduced a new platen for its 200-mm wafer chemical mechanical planarization (CMP) system designed to extend reliable control of polishing processes ...
A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...
SAN LUIS OBISPO, Calif., July 6, 2023 /PRNewswire/ -- Revasum today announced the availability of 200mm SiC wafer polishing capability on their 6EZ chemical mechanical polishing platform. The 6EZ has ...
This will expand the role of advanced CMP consumables, high-precision metrology, and contamination control. Epi wafers gain strategic value As device architectures become more demanding, epi quality ...
Dublin, Oct. 16, 2020 (GLOBE NEWSWIRE) -- The "CMP Equipment and Consumables: Market Analysis and Forecasts" report from The Information Network has been added to ResearchAndMarkets.com's offering.
In the field of semiconductor wafer manufacturing, Topco continues to enhance the supply of silicon wafers, furnace tube quartz and CMP slurry used in the diffusion process, thin films and etching-use ...
Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...
LONDON — Circuits Multi Projets (CMP), a multiproject wafer run aggregator, has introduced access to a 65-nanometer CMOS process from STMicroelectronics NV. The ST 65-nm library includes process ...
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