TL;DR: Huawei is set to lead Apple by integrating high-performance HBM DRAM with 3D stacking technology in smartphones, boosting AI efficiency and bandwidth while reducing chip size. Apple plans to ...

Cloud service providers are accelerating in-house ASIC development to gain tighter control over performance and costs. DIGITIMES projects that between 2025 and 2029, the compound annual growth rate ...

The tech world has been going wild over AI since we first started hearing about generative language models and the likes. Things have only escalated with more companies adopting AI powered computing, ...

A new technical paper titled “3D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency” was published by a researcher from Georgia Institute of ...