Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Designers are utilizing an array of programmable or configurable ICs to keep pace with rapidly changing technology and AI.

Ensuring that verification platforms can scale with industry demands and support new use cases as they emerge.

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...

Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.

In today’s fast-paced electronics design automation (EDA) environment, effective data management has become essential.

A new technical paper titled “Effects of Proton Radiation on Tin Oxide: Implications for Space Electronics” was published by ...

An agentic AI-based approach to end-to-end bug resolution using both error logs and waveforms.

Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...

Driven On-Chip Integration for High Density and Low Cost” was published by researchers at University of Southern California.

Researchers from the University of Southern California Information Sciences Institute and the University of Wisconsin-Madison ...

Using AI and machine learning as transformative solutions for semiconductor device modeling and parameter extraction.