Teradyne announces Omnyx, a test platform for printed circuit board assemblies engineered to meet the requirements of AI and ...

Siemens today announced the Fusetm EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and ...

Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has invested in Elephantech Inc., a startup developing proprietary nano-ink technology for inkjet printing, and signed a ...

Dymax, a manufacturer of light-curing materials and equipment, will exhibit at APEX EXPO 2026, held March 17 to March 19, 2026, at the Anaheim Convention Center in Anaheim, California. Visitors can ...

The Philippines-based company says it has invested to increase the volume of printed circuit boards it can process for recycling.

Intelligent Asia Thailand 2026, Southeast Asia's leading B2B platform for PCB manufacturing and industrial automation, will take place from 11 to 13 March 2026 at Event Hall 98, BITEC, Bangkok. The ...

The 385,000-square-foot facility in Glasgow will produce essential components for the manufacturing of semiconductor chips.

SCHMID Group (NASDAQ: SHMD), a leading global supplier of advanced wet process equipment for the electronics manufacturing industry, has secured a lower two-digit million-USD purchase order from a ...

Announces new $7 billion Share Repurchase Authorization; Announces 21% increase in quarterly dividend level to $2.30 per share from $1.90; Reaffirms current March 2026 quarter gui ...

The Indian government has eased Press Note 3 (PN3) restrictions, allowing automatic approval for non-controlling investments of up to 10% from land-bordering countries and introducing a 60-day ...

Multi-die design using 2.5D and 3D technologies has emerged as a necessity to keep the pace of innovation. For all their benefits, these projects present new challenges. This post considers monitoring ...