Taiwan Semiconductor Manufacturing Co. (TSMC) intends to invest US$100 billion in chipmaking plants in the United States over ...

Citi analysts have pointed to the lack of recovery in semiconductor exports, particularly in Multi Chip Packages (MCP), including High Bandwidth (NASDAQ: BAND) Memory (HBM), following a significant ...

SK Hynix has reportedly reached a significant milestone in its pre-production trials by raising the yield rate of its ...

Qualcomm is reportedly developing its next-generation high-end processor for Windows PCs, the Snapdragon X2. The new chip is ...

SK hynix has reportedly achieved a yield of 70% for its next-gen HBM4 12-Hi memory, ready for NVIDIA's next-gen Rubin R100 AI ...

Qualcomm is reportedly developing a desktop Arm processor with 18 Oryon v3 CPU cores. It might be called the Snapdragon X2 ...

SK hynix said Tuesday it has started construction on its first fabrication plant and relevant facilities at an envisioned ...

SK Hynix has advanced the groundbreaking of its first-phase Yongin Semiconductor Cluster plant (Yongin 1) from March 2025 to ...

South Korea’s second-largest conglomerate, SK Group, has revealed plans to invest billions of dollars in Vietnam, marking a ...

SK hynix has tapped Vice President Lee Woong-sun to spearhead its advanced chip packaging plant in the US. Lee has been ...

The US Trump administration is reportedly planning to renegotiate the Chips and Science Act deals finalized under the previous administration, putting Korean chipmakers on edge as the subsidies ...

A new head will oversee the construction of SK hynix's $3.87 billion facility at the Purdue Research Park, with the plant ...